Executive Vice President
TongxinMicro
Graduated from Tsinghua University with a master’s degree in Integrated Circuit and over ten years of IC marketing experience. With deep participation in national level projects of Core Electronic Devices and the NRDC Financial Project, obtaining of multiple national invention patents, John and his team achieved the first international authoritative certification in China including CC EAL6+ security certification and GSMA SAS-UP wafer level personalization. Upon the considerable effort on industrialization landing, global operation and promotion of Chinese secure chips in the fields of communication, finance, consumer electronics, and automotive electronics, John brought TongxinMicro to the position of global market leader in SIM card chips.